Photonics Senior Packaging and Assembly Engineer
Company: Intel
Location: Richmond
Posted on: May 27, 2023
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Job Description:
Job Description
Intel Silicon Photonics Product Division (SPPD) is at the forefront
of silicon photonics integration and is part of The Connectivity
Group which is at the heart of Intel's transformation from a PC
company to a company that powers the cloud and billions of smart,
connected computing devices. Since announcing the world's first
hybrid silicon laser nearly a decade ago, our team continues to
lead the industry with cutting-edge technology and efficient,
scalable high-volume manufacturing. Our dedication to advanced
development ensures that Intel Silicon Photonics continues to drive
future data center bandwidth growth with smaller form factors,
co-packaging, and higher speeds from 400G today to 1.6T+ and beyond
tomorrow. We are looking for great talent to accelerate this
journey so if you are interested in joining our leading
organization then we want to hear from you.
SPPD is looking for a motivated candidate to lead the OSAT assembly
process development for LiDAR. The candidate for this position will
be responsible to drive technology development programs, coming up
with innovative solutions, planning experiments, and providing
resources to drive the OSAT team to develop high yield
cost-effective LiDAR assembly processes, and control systems for
volume production on schedule and within budget. The applicant
should be self-driven, have a solid technical background in process
development fundamentals, with excellent documentation and
communication skills across multiple cultures.
This leader will be required to partner across SPPD, Internal and
external assembly (OSAT), our end customers, and with material
suppliers. One key aspect of the job will require remote managing
OSAT process development to enable successful product launch and
ramp. OSAT management includes regular meeting coordination, AR
tracking, removing roadblocks to enable faster data turns,
balancing external customer requirements within OSAT feasible
process window and proactively building data to demonstrate process
qualification.
The Photonics Senior Packaging and Assembly Engineer will be
responsible for:
Take Silicon Photonics wafer and chip level packaging and assembly
product from concept to HVM release through an OSAT partner
Leveraging expertise in the development of advanced packaging
technology and processes and expertise in substrate materials and
molding compound materials, work with cross-functional teams to
select the optimized package solution, like, FCBGA, FCMCM, WLCSP
fan in, wafer or panel level fan out, chip on-chip, package on
package, stacked die, TSV Si interposer, etc.
Oversee and lead the OSAT as well as internal packaging process
development effort from concept through initial production ramp
Lead new equipment selection and installation activities if needed
to support new bumping or assembly process development
Lead Failure and Root cause analysis and feedback to OSAT assembly
process, SPC metrics to achieve high end-to-end assembly yield
Drive DFx for IC packaging design and assembly, Process FMEA,
characterization, and monitoring
The candidate should exhibit the following behavioral traits:
Strong structure model-based problem-solving skills
Highly self-motivated technical leader with the skills to
multi-task and prioritize in a dynamic environment
Qualifications
You must possess the minimum qualifications to be initially
considered for this position. Preferred qualifications are in
addition to the minimum requirements and are considered a plus
factor in identifying top candidates.
Education Requirement:
Minimum Qualifications:
5+ years of hands-on experience in state-of-the-art CMOS (Intel)
and/or photonics area with substantial package assembly process
development and integration experience
5+ years of experience with the latest generation wafer and
assembly technologies - Wafer bumping and die prep, Flip Chip
including Thermal Compression Bonding, Wire-bond, Heat Spreader
Attach, Multichip packaging assembly, and the associated processes,
materials, and equipment
Preferred Qualifications:
5+ years of hands-on experience with package assembly tools is a
plus
Experience working to develop and bring new packaging/assembly
processes through the development and into manufacturing, including
the successful introduction of new products
Demonstrated strength to work both with internal teams as well as
with external suppliers, and Out Sourced Assembly and Test vendors
(OSATs) to lead development activities
Knowledge of failure analysis and assembly metrology techniques
This position is not eligible for Intel immigration
sponsorship.
Inside this Business Group
Corporate Strategy Office is chartered to support the executive
office in driving corporate initiatives, including near and
long-term strategy, major cross-group decision making and ensuring
cross-company alignment. To deliver to that mission, the team owns
shaping, driving and synthesizing insights to directionally orient
trends as well as long range strategic planning/visioning , cross
company alignment and greenfield innovation. Communications are
essential to drive alignment so there is a focus on communications,
community and acumen development. The team is ccommitted to
ensuring that Intel efforts are aligned to, and actively driving
success toward the most impactful business strategies.
Other Locations
US,NM,Albuquerque;US,CA,Santa Clara
Covid Statement
Intel strongly encourages employees to be vaccinated against
COVID-19. Intel aligns to federal, state, and local laws and as a
contractor to the U.S. Government is subject to government mandates
that may be issued. Intel policies for COVID-19 including guidance
about testing and vaccination are subject to change over time.
Posting Statement
All qualified applicants will receive consideration for employment
without regard to race, color, religion, religious creed, sex,
national origin, ancestry, age, physical or mental disability,
medical condition, genetic information, military and veteran
status, marital status, pregnancy, gender, gender expression,
gender identity, sexual orientation, or any other characteristic
protected by local law, regulation, or ordinance.
Benefits
We offer a total compensation package that ranks among the best in
the industry. It consists of competitive pay, stock, bonuses, as
well as, benefit programs which include health, retirement, and
vacation. Find more information about all of our Amazing Benefits
here:
https://www.intel.com/content/www/us/en/jobs/benefits.html
Annual Salary Range for jobs which could be performed in US,
California: $118,860.00-$196,720.00
*Salary range dependent on a number of factors including location
and experience
Working Model
This role will be eligible for our hybrid work model which allows
employees to split their time between working on-site at their
assigned Intel site and off-site. In certain circumstances the work
model may change to accommodate business needs.
Keywords: Intel, Richmond , Photonics Senior Packaging and Assembly Engineer, Engineering , Richmond, Virginia
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